Wafer-to-wafer alignments

ABSTRACT

Structures for aligning wafers and methods for operating the same. The structure includes (a) a first semiconductor wafer including a first capacitive coupling structure, and (b) a second semiconductor wafer including a second capacitive coupling structure. The first and second semiconductor wafers are in direct physical contact with each other via a common surface. If the first and second semiconductor wafers are moved with respect to each other by a first displacement distance of 1 nm in a first direction while the first and second semiconductor wafers are in direct physical contact with each other via the common surface, then a change of at least 10 −18  F in capacitance of a first capacitor comprising the first and second capacitive coupling structures results. The first direction is essentially parallel to the common surface.

This application is a divisional of Ser. No. 11/275,112, filed Dec. 12,2005.

BACKGROUND OF THE INVENTION

1. Technical Field

The present invention relates to wafer-to-wafer alignments, and morespecifically, to wafer-to-wafer alignments using capacitive couplingstructures.

2. Related Art

In the prior art, two wafers containing devices can be aligned and thenbonded together so as to, among other purposes, double the devicedensity. As a result, there is always a need for a structure (andmethods for operating the same) that helps achieve good wafer-to-waferalignments for subsequent wafer bonding process.

SUMMARY OF THE INVENTION

The present invention provides a structure, comprising (a) a firstsemiconductor wafer including a first capacitive coupling structure; and(b) a second semiconductor wafer including a second capacitive couplingstructure, wherein the first and second semiconductor wafers are indirect physical contact with each other via a common surface, wherein ifthe first and second semiconductor wafers are moved with respect to eachother by a first displacement distance of 1 nm in a first directionwhile the first and second semiconductor wafers are in direct physicalcontact with each other via the common surface, then a change of atleast 10⁻¹⁸ F in capacitance of a first capacitor comprising the firstand second capacitive coupling structures results, and wherein the firstdirection is essentially parallel to the common surface.

The present invention also provides a wafer alignment method, comprisingproviding a structure which includes (a) a first semiconductor wafercomprising a first capacitive coupling structure, and (b) a secondsemiconductor wafer comprising a second capacitive coupling structure;measuring a capacitance of a first capacitor comprising the first andsecond capacitive coupling structures; and moving the first and secondsemiconductor wafers with respect to each other in a first directionwhile the first and second semiconductor wafers are in direct physicalcontact with each other via a common surface, until the first capacitorhas a first maximum capacitance as measured in said measuring thecapacitance of the first capacitor, wherein the first direction isessentially parallel to the common surface.

The present invention also provides a wafer alignment method, comprisingproviding a structure which includes (a) a first semiconductor wafercomprising first and third capacitive coupling structures and (b) asecond semiconductor wafer comprising second and fourth capacitivecoupling structures, wherein each capacitive coupling structure of thefirst and second capacitive coupling structures comprises M capacitivecoupling fingers of a first finger width, M being an integer greaterthan 1, wherein each capacitive coupling structure of the third andfourth capacitive coupling structures comprises N capacitive couplingfingers of a second finger width, N being an integer greater than 1, andwherein the first finger width is at least twice the second fingerwidth; measuring a capacitance of a first capacitor comprising the firstand second capacitive coupling structures; moving the first and secondsemiconductor wafers with respect to each other in a first directionwhile the first and second semiconductor wafers are in direct physicalcontact with each other via a common surface, until the first capacitorhas a first maximum capacitance as measured in said measuring thecapacitance of the first capacitor, wherein the first direction isessentially parallel to the common surface; measuring a capacitance of asecond capacitor comprising the third and fourth capacitive couplingstructures; and after said moving the first and second semiconductorwafers until the first capacitor has the first maximum capacitance,moving the first and second semiconductor wafers with respect to eachother in the first direction while the first and second semiconductorwafers are in direct physical contact with each other via the commonsurface, until the second capacitor has a second maximum capacitance asmeasured in said measuring the capacitance of the second capacitor.

The present invention provides a structure (and methods for operatingthe same) that helps achieve good wafer-to-wafer alignments forsubsequent wafer bonding process.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1, 1A, 2, and 2A show different views of two capacitive couplingstructures, in accordance with embodiments of the present invention.

FIG. 2B shows how to align the two capacitive coupling structures ofFIG. 2A, in accordance with embodiments of the present invention.

FIGS. 3A-3B show a first position of the two capacitive couplingstructures of FIG. 1 in two semiconductor wafers, in accordance withembodiments of the present invention.

FIG. 4 shows a second position of the two capacitive coupling structuresof FIG. 1 in two semiconductor wafers, in accordance with embodiments ofthe present invention.

FIGS. 5 and 6 show an arrangement of different capacitive couplingstructures on two wafers, in accordance with embodiments of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

FIGS. 1, 1A, 2, and 2A show different views of two capacitive couplingstructures 110 and 210, in accordance with embodiments of the presentinvention. More specifically, FIG. 1 shows a perspective view of the twocapacitive coupling structures 110 and 210. Illustratively, thecapacitive coupling structure 110 comprises three capacitive couplingfingers 112 a, 112 b, and 112 c and a common base 114, wherein thecommon base 114 physically holds and electrically connects together thethree capacitive coupling fingers 112 a, 112 b, and 112 c.

Similarly, the capacitive coupling structure 210 comprises threecapacitive coupling fingers 212 a, 212 b, and 212 c and a common base214, wherein the common base 214 physically holds and electricallyconnects together the three capacitive coupling fingers 212 a, 212 b,and 212 c. In one embodiment, each of the capacitive coupling structures110 and 210 is made of an electrically conducting material (such as ametal).

FIG. 1A shows a cross section view of the two capacitive couplingstructures 110 and 210 in two semiconductor wafers 100 and 200,respectively.

The capacitive coupling fingers 112 a, 112 b, and 112 c of thecapacitive coupling structure 110 are buried in the semiconductor wafer100 but are physically close to a top surface 115 of the semiconductorwafer 100. Similarly, the capacitive coupling fingers 212 a, 212 b, and212 c of the capacitive coupling structure 210 are buried in thesemiconductor wafer 200 but are physically close to a top surface 215 ofthe semiconductor wafer 200.

In one embodiment, if the two semiconductor wafers 100 and 200 are movedwith respect to each other while the their top surfaces 115 and 215 arein direct physical contact with each other and in the same plane (ashappening during the alignment of the two semiconductor wafers 100 and200), then the capacitive coupling fingers 112 a, 112 b, and 112 c (i)do not come into direct physical contact with and (ii) are electricallyinsulated from the capacitive coupling fingers 212 a, 212 b, and 212 c.In other words, the two capacitive coupling structures 110 and 210 areelectrically insulated from each other during such an alignment.

In FIGS. 1 and 1A, the capacitive coupling fingers 112 a, 112 b, and 112c are completely aligned with the capacitive coupling fingers 212 a, 212b, and 212 c, respectively. If so, it is said that the two capacitivecoupling structures 110 and 210 are completely aligned. In oneembodiment, if the two capacitive coupling structures 110 and 210 arecompletely aligned, then the contact pads (not shown, but electricallycoupled to the devices and wires of the wafer 100) fabricated on the topsurface 115 are in direct physical contact one-to-one with the contactpads (not shown but electrically coupled to the devices and wires of thewafer 200) fabricated on the top surface 215 such that the twosemiconductor wafers 100 and 200 can be now bonded together. In oneembodiment, when the two capacitive coupling structures 110 and 210 arecompletely aligned, the capacitance of a capacitor 110,210 comprisingthe two capacitive coupling structures 110 and 210 is maximum.

FIG. 2 shows the two semiconductor wafers 100 and 200 after thesemiconductor wafer 100 moves to the left in a direction 990 withrespect to the semiconductor wafer 200 by a displacement distance 992equal to, illustratively, one half the finger width 991 of thecapacitive coupling finger 212 a. FIG. 2A shows a top down view of onlythe two capacitive coupling structures 110 and 210 of FIG. 2 (i.e.,after the movement).

With reference to FIGS. 2 and 2A, assume that all the capacitivecoupling fingers of the two capacitive coupling structures 110 and 210have the same finger width. Then, this movement of the semiconductorwafer 100 with respect to the semiconductor wafer 200 reduces thecapacitance of the capacitor 110,210 by half. This is because thecapacitance of the capacitor 110,210 is proportional to the overlappingareas of the two capacitive coupling structures 110 and 210. Because themovement of the semiconductor wafer 100 with respect to thesemiconductor wafer 200 reduces the overlapping areas of the twocapacitive coupling structures 110 and 210 by half, the capacitance ofthe capacitor 110,210 is reduced also by half.

In one embodiment, each of the capacitive coupling structures 110 and210 has N capacitive coupling fingers (N is a positive integer). In oneembodiment, a capacitance meter 305 (FIG. 2A) is electrically coupled tothe two capacitive coupling structures 110 and 210 so as to measure thecapacitance of the capacitor 110,210 during the alignment of thesemiconductor wafers 100 and 200.

In one embodiment, the semiconductor wafers 100 and 200 are aligned forbonding as follows. The first and second semiconductor wafers 100 and200 are moved with respect to each other while the their top surfaces115 and 215 are in direct physical contact with each other and in thesame plane until the capacitance of the capacitor 110,210 as measured bythe capacitance meter 305 is maximum indicating the two capacitivecoupling structures 110 and 210 are completely aligned. Then, the twosemiconductor wafers 100 and 200 are bonded together using aconventional wafer bonding process.

More specifically, with reference to FIGS. 2A and 2B, in one embodiment,the alignment of the semiconductor wafers 100 and 200 is controlled by aprocessor 307 (FIG. 2A) that is coupled to the capacitance meter 305 anda stepping motor 309 (FIG. 2A). Illustratively, during the alignment ofthe semiconductor wafers 100 and 200, the stepping motor 309 moves thesemiconductor wafer 100 with respect to the semiconductor wafer 200under the control of the processor 307.

In one embodiment, the alignment of the semiconductor wafers 100 and 200is performed as follows. The stepping motor 309 moves the semiconductorwafer 100 with respect to the semiconductor wafer 200 in equal steps inthe direction 990 (FIG. 2A) through relative positions corresponding topoints A, B, C, D, E, and F (or in short, the relative positions A, B,C, D, E, and F, respectively) in that order while the processor 307collects capacitance measurements at each of the relative positions A,B, C, D, E, and F. At relative position F, the processor 307 recognizesthat there was two capacitance drops in a row. In response, theprocessor 307 generates a fitting curve 311 (FIG. 2B) for the points A,B, C, D, E, and F and finds the maximum point M of the fitting curve311. In one embodiment, the fitting curve 311 is generated using theleast-square quadratic curve-fitting method. Next, the processor 307determines that the relative position on the horizontal axis associatedwith the maximum point M is closest to relative position D. As a result,the processor 307 causes the stepping motor 309 to move thesemiconductor wafer 100 back to relative position D, and the alignmentof the semiconductor wafers 100 and 200 is complete in the direction 990(FIG. 2A).

In one embodiment, if the first and second semiconductor wafers 100 and200 are moved with respect to each other while they are in directphysical contact with each other via a common surface 115,215 (becausethe top surfaces 115 and 215 merge) by a displacement distance of 1 nmin the direction 990 (or in a direction opposite to the direction 990),then a change of at least 10⁻¹⁸ F in capacitance of the capacitor110,210 results.

FIGS. 3A-3B show a first position of the two capacitive couplingstructures 110 and 210 in the two semiconductor wafers 100 and 200,respectively, in accordance with embodiments of the present invention.More specifically, with reference to FIG. 3A, the capacitive couplingstructure 110 resides in a dicing channel 120 of the semiconductor wafer100 and in a device layer 130 that comprises illustratively, transistors132 a, 132 b, and 132 c. It should be noted that directly above thedevice layer 130 are, illustratively, interconnect layers 142, 144, 146,and 148 wherein the interconnect layer 148 is the top interconnectlayer.

Similarly, the capacitive coupling structure 210 resides in a dicingchannel 220 of the semiconductor wafer 200 and in a device layer 230that comprises illustratively, transistors 232 a, 232 b, and 232 c. Itshould be noted that directly above the device layer 230 are,illustratively, interconnect layers 242, 244, 246, and 248 wherein theinterconnect layer 248 is the top interconnect layer.

In one embodiment, the alignment of the two semiconductor wafers 100 and200 is performed by gliding the two semiconductor wafers 100 and 200against each other such that the two top surfaces 115 and 215 slideagainst each other. During this alignment process, the two capacitivecoupling structures 110 and 210 are always electrically insulated fromeach other by the buried oxide (BOX) layers 150 and 250. When thecapacitance meter 305 detects a maximum capacitance of the capacitor110,210, then the two semiconductor wafers 100 and 200 are completelyaligned. It should be noted that the alignment process described abovewill be followed by a back-to-back wafer bonding process.

In one embodiment, the capacitive coupling structure 110 resides in thesame semiconductor layer as the transistors 132 a, 132 b, and 132 c.Illustratively, the capacitive coupling structure 110 comprises a dopedsilicon region 118 and a silicide region 119. In one embodiment, thedoped silicon region 118 is doped at the same time the source/drainregions of the transistors 132 a, 132 b, and 132 c are doped. Then, thesilicide region 119 is formed at the same time the silicide regions (notshown) of the transistors 132 a, 132 b, and 132 c are formed. In oneembodiment, the capacitive coupling structure 210 resides is formed inthe semiconductor wafer 200 in a similar manner.

FIG. 3B is similar to FIG. 3A, except that the layer 130 comprisesdielectric materials in the channel region 120 and that the capacitivecoupling structure 110 is surrounded by these dielectric materials. Inone embodiment, the space for the capacitive coupling structure 110 iscreated at the time the contact holes 133 for the transistors 132 a, 132b, and 132 c are created. Then, the space for the capacitive couplingstructure 110 and the contact holes 133 are simultaneously filled with asame conducting material (e.g., tungsten) so as to form the capacitivecoupling structure 110. In one embodiment, the capacitive couplingstructure 210 resides is formed in the semiconductor wafer 200 in asimilar manner.

FIG. 3C shows how the capacitive coupling structure 110 of FIG. 3B canbe connected to an edge 180 of the semiconductor wafers 100 (whether thecapacitive coupling structure 110 resides in a dicing channel or in aregion near the edge 180). It should be noted that the probe pad 170 onthe edge 180 can be used to electrically access the capacitive couplingstructure 110.

FIG. 4 shows a second position of the two capacitive coupling structures110 and 210 in the two semiconductor wafers 100 and 200, respectively,in accordance with embodiments of the present invention. Morespecifically, the capacitive coupling structure 110 resides in thedicing channel 120 of the semiconductor wafer 100 and in the next-to-topinterconnect layer 146. Similarly, the capacitive coupling structure 210resides in the dicing channel 220 of the semiconductor wafer 200 and inthe next-to-top interconnect layer 246.

In one embodiment, the alignment of the two semiconductor wafers 100 and200 is performed by gliding the two semiconductor wafers 100 and 200against each other such that the two top surfaces 115 and 215 slideagainst each other. During this alignment process, the two capacitivecoupling structures 110 and 210 are always electrically insulated fromeach other by the top interconnect layer 148 and 248 which compriseessentially dielectric materials in the dicing channels 120 and 220,respectively. When the capacitance meter 305 (FIG. 2A) detects a maximumcapacitance of the capacitor 110,210, then the two semiconductor wafers100 and 200 are completely aligned. It should be noted that thealignment process described above will be followed by a top-to-top waferbonding process.

FIG. 5 shows a top down view of a semiconductor wafer 500 illustratingan arrangement of, illustratively, four capacitive coupling structures510 a, 510 b, 510 c, and 510 d near the edge 505 of the semiconductorwafer 500, in accordance with embodiments of the present invention. Eachof the five capacitive coupling structures 510 a, 510 b, 510 c, and 510d is similar in shape to the capacitive coupling structures 110 and 210of FIG. 1. The semiconductor wafer 500 also comprises multipleintegrated circuits (chips) 520.

FIG. 6 shows a top down view of a semiconductor wafer 600 which is to bealigned and bonded to the semiconductor wafer 500 of FIG. 5. In oneembodiment, with reference to FIGS. 5 and 6, the semiconductor wafer 600is a mirror image of the semiconductor wafer 500 with respect to thefour capacitive coupling structures 510 a, 510 b, 510 c, and 510 d. Inother words, the semiconductor wafer 600 comprises four capacitivecoupling structures 610 a, 610 b, 610 c, and 610 d, such that when thesemiconductor wafers 500 and 600 are completely aligned, the fourcapacitive coupling structures 510 a, 510 b, 510 c, and 510 d arecompletely aligned with the four capacitive coupling structures 610 a,610 b, 610 c, and 610 d, respectively. As a result, the four capacitivecoupling structures 610 a, 610 b, 610 c, and 610 d are also near an edge605 of the semiconductor wafer 600,

In one embodiment, with reference to FIGS. 5 and 6, the fingers 510 a′of the capacitive coupling structure 510 a are parallel to one anotherand to a direction 530, whereas the fingers 510 b′ of the capacitivecoupling structure 510 b are parallel to one another and to a direction540. In one embodiment, the directions 530 and 540 are essentiallyperpendicular to each other.

As a result, the capacitor 510 a,610 a comprising the capacitivecoupling structures 510 a and 610 a can be used to align thesemiconductor wafers 500 and 600 in the direction 540. This is because amovement of the semiconductor wafer 600 with respect to thesemiconductor wafer 500 in the direction 540 would result in asignificant change in the capacitance of the capacitor 510 a,610 a.

Similarly, the capacitor 510 b,610 b comprising the capacitive couplingstructures 510 b and 610 b can be used to align the semiconductor wafers500 and 600 in the direction 530. This is because a movement of thesemiconductor wafer 600 with respect to the semiconductor wafer 500 inthe direction 530 would result in a significant change in thecapacitance of the capacitor 510 b,610 b.

In one embodiment, the semiconductor wafers 500 and 600 comprisecapacitive coupling structures (not shown) in the dicing channels 550and 650, respectively, which are similar in size and shape to thecapacitive coupling structures 110 and 210 of FIGS. 1 and 1A.

In one embodiment, the semiconductor wafers 500 and 600 compriseelectrically conducting lines connecting all the capacitive couplingstructures of the semiconductor wafers 500 and 600 to probe pads (notshown) on the edges 505 and 506 of the semiconductor wafers 500 and 600,respectively, so that the capacitive coupling structures can beelectrically accessed via the probe pads during wafer alignment. For thecapacitive coupling structures residing in the dicing channels 550 and650, the associated electrically conducting lines run along the dicingchannels 550 and 650 to the associated probe pads located on the edges505 and 506.

In one embodiment, the capacitive coupling structure 510 a, 510 b, 610a, and 610 b have a finger width of 10 μm and a finger spacing (i.e.,the distance between two adjacent fingers, such as the finger spacing260 of the capacitive coupling structure 210 of FIG. 2A) of 50 μm,whereas the capacitive coupling structure 510 c, 510 d, 610 c, and 610 dhave a finger width of 1 μm and a finger spacing of 5 μm. Assume thatall the capacitive coupling fingers have the same length.

As a result, in one embodiment, the capacitors 510 a,610 a and 510 b,610 b are used for crude alignments of the semiconductor wafers 100 and200 in the directions 540 and 530, respectively. Then, the capacitors510 c,610 c and 510 d, 610 d are used for fine alignments of thesemiconductor wafers 100 and 200 in the directions 540 and 530,respectively. Alternatively, the capacitive coupling structures (notshown) located in the dicing channels 550 and 650 can be used for thefine alignment of the semiconductor wafers 100 and 200. It should benoted that the capacitive coupling structures of the same capacitor havethe same number of fingers, but the capacitive coupling structures ofdifferent capacitors can have different number of fingers.

In the embodiments described above, the finger spacing of the capacitorsused for crude alignments is five times the finger spacing of thecapacitors used for fine alignments (i.e., 50 μm and 10 μm). In general,the finger spacing of the capacitors used for crude alignments is atleast twice the finger spacing of the capacitors used for finealignments.

In the embodiments described above, the finger widths of the fingers ofthe capacitive coupling structures 110 and 210 (FIG. 2A) are all thesame. In general, with reference to FIG. 2A, these finger widths do nothave to be the same. More specifically, although the finger widths ofthe fingers 112 a and 212 a are the same, the finger widths of thefingers 112 a and 112 b can be different.

While particular embodiments of the present invention have beendescribed herein for purposes of illustration, many modifications andchanges will become apparent to those skilled in the art. Accordingly,the appended claims are intended to encompass all such modifications andchanges as fall within the true spirit and scope of this invention.

1. A structure, comprising: (a) a first semiconductor wafer including afirst capacitive coupling structure; and (b) a second semiconductorwafer including a second capacitive coupling structure, wherein thefirst and second semiconductor wafers are in direct physical contactwith each other via a common surface, wherein if the first and secondsemiconductor wafers are moved with respect to each other by a firstdisplacement distance of 1 nm in a first direction while the first andsecond semiconductor wafers are in direct physical contact with eachother via the common surface, then a change of at least 10⁻¹⁸ F incapacitance of a first capacitor comprising the first and secondcapacitive coupling structures results, and wherein the first directionis essentially parallel to the common surface.
 2. The structure of claim1, wherein the first capacitive coupling structure comprises N firstcapacitive coupling fingers, N being an integer greater than 1, andwherein the second capacitive coupling structure comprises N secondcapacitive coupling fingers.
 3. The structure of claim 2, wherein the Nfirst capacitive coupling fingers are aligned one-to-one to the N secondcapacitive coupling fingers.
 4. The structure of claim 3, wherein the Nfirst capacitive coupling fingers are parallel to one another, andwherein the N first capacitive coupling fingers have a same fingerwidth.
 5. The structure of claim 3, wherein the N first capacitivecoupling fingers are parallel to one another, and wherein the N firstcapacitive coupling fingers do not have a same finger width.
 6. Thestructure of claim 1, wherein the first semiconductor wafer furthercomprises a third capacitive coupling structure, wherein the secondsemiconductor wafer further comprises a fourth capacitive couplingstructure, wherein if the first and second semiconductor wafers aremoved with respect to each other by a second displacement distance of 1nm in a second direction while the first and second semiconductor wafersare in direct physical contact with each other via the common surface,then a change of at least 10⁻¹⁸ F in capacitance of a second capacitorcomprising the third and fourth capacitive coupling structures results,wherein the second direction is essentially parallel to the commonsurface, and wherein the first and second directions are essentiallyperpendicular to each other.
 7. The structure of claim 1, wherein thefirst capacitive coupling structure resides in a first dicing channel ofthe first semiconductor wafer, and wherein the second capacitivecoupling structure resides in a second dicing channel of the secondsemiconductor wafer.
 8. The structure of claim 1, wherein the firstcapacitive coupling structure does not reside in a dicing channel or achip area of the first semiconductor wafer, and wherein the secondcapacitive coupling structure does not reside in a dicing channel or achip area of the second semiconductor wafer.
 9. A wafer alignmentmethod, comprising: providing a structure which includes (a) a firstsemiconductor wafer comprising a first capacitive coupling structure,and (b) a second semiconductor wafer comprising a second capacitivecoupling structure; measuring a capacitance of a first capacitorcomprising the first and second capacitive coupling structures; andmoving the first and second semiconductor wafers with respect to eachother in a first direction while the first and second semiconductorwafers are in direct physical contact with each other via a commonsurface, until the first capacitor has a first maximum capacitance asmeasured in said measuring the capacitance of the first capacitor,wherein the first direction is essentially parallel to the commonsurface.
 10. The method of claim 9, further comprising: measuring acapacitance of a second capacitor comprising third and fourth capacitivecoupling structures, wherein the first semiconductor wafer furthercomprises the third capacitive coupling structure, and wherein thesecond semiconductor wafer further comprises the fourth capacitivecoupling structure; and moving the first and second semiconductor waferswith respect to each other in a second direction while the first andsecond semiconductor wafers are in direct physical contact with eachother via the common surface, until the second capacitor has a secondmaximum capacitance as measured in said measuring the capacitance of thesecond capacitor, wherein the second direction is essentially parallelto the common surface, and wherein the first and second directions areessentially perpendicular to each other.
 11. The method of claim 9,wherein if the first and second semiconductor wafers are moved withrespect to each other by a displacement distance of 1 nm in the firstdirection while the first and second semiconductor wafers are in directphysical contact with each other via the common surface, then a changeof at least 10⁻¹⁸ F in capacitance of the first capacitor results. 12.The method of claim 9, wherein the first capacitive coupling structurecomprises N first capacitive coupling fingers, N being an integergreater than 1, and wherein the second capacitive coupling structurecomprises N second capacitive coupling fingers.
 13. The method of claim12, wherein the N first capacitive coupling fingers are parallel to oneanother, and wherein the N first capacitive coupling fingers have a samefinger width.
 14. The method of claim 12, wherein the N first capacitivecoupling fingers are parallel to one another, and wherein the N firstcapacitive coupling fingers do not have a same finger width.
 15. Themethod of claim 9, wherein the first capacitive coupling structureresides in a first dicing channel of the first semiconductor wafer, andwherein the second capacitive coupling structure resides in a seconddicing channel of the second semiconductor wafer.
 16. The method ofclaim 9, wherein the first capacitive coupling structure does not residein a dicing channel or a chip area of the first semiconductor wafer, andwherein the second capacitive coupling structure does not reside in adicing channel or a chip area of the second semiconductor wafer.